RELIFE SP-50 158℃ LOW TEMPERATURE BGA IC SOLDER PASTE SPECIAL TIN PASTE FOR CPU MOBILE PHONE MOTHERBOARD REPAIR 50G | ShopHere

RELIFE SP-50 158℃ LOW TEMPERATURE BGA IC SOLDER PASTE SPECIAL TIN PASTE FOR CPU MOBILE PHONE MOTHERBOARD REPAIR 50G

Name: RELIFE SP-50 158℃ LOW TEMPERATURE BGA IC SOLDER PASTE SPECIAL TIN PASTE FOR CPU MOBILE PHONE MOTHERBOARD REPAIR 50G
SKU: 555934
Price: 1650.00 LKR
Availability: InStock

Availability: In Stock

රු1,650.00

SEARCH

RELIFE SP-50 158℃ LOW TEMPERATURE BGA IC SOLDER PASTE SPECIAL TIN PASTE FOR CPU MOBILE PHONE MOTHERBOARD REPAIR 50G