RELIFE F-21 NEW EMULSIFIED ADVANCED SOLDER FLUX SET FOR MOBILE PHONE CHIP WELDING AND BGA TIN PLANTING | ShopHere

RELIFE F-21 NEW EMULSIFIED ADVANCED SOLDER FLUX SET FOR MOBILE PHONE CHIP WELDING AND BGA TIN PLANTING

Name: RELIFE F-21 NEW EMULSIFIED ADVANCED SOLDER FLUX SET FOR MOBILE PHONE CHIP WELDING AND BGA TIN PLANTING
SKU: 554546
Price: 1000.00 LKR
Availability: InStock

Availability: In Stock

රු1,000.00

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RELIFE F-21 NEW EMULSIFIED ADVANCED SOLDER FLUX SET FOR MOBILE PHONE CHIP WELDING AND BGA TIN PLANTING